White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component
TIS™680-12AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature curable,long working time and firere sistance.lt is especially suitable for capacitor, small electronic equipment sealing. Its flexible, elastic characteristics enable it to provide cushioning for the materials it is coated with. The lower viscosity aliows the thermal potting adhesive to cover the surface more fully,greatly increasing the efficiency of heat transfer from the heating device or the entire PCB to the metal case or diffusion plate,thus improving the efficiency and service life of the electronic.
TIS680-12AB-Series-TDS-REV04--High-Thermal-Conduct...
Features
> Good thermal conductive: 1.2W/mK
> Good insulation performance
> Good elasticity
> Lower shrinkage
> Low viscosity, easy gas emissions
> Good solvent resistance and waterproof performance
> longer working hours
> Excellent high and low temperature resistance
> No odor release during the curing process
Application
> Industrial control,transformer,coil, amplifier, high voltage package, relay, high current junction box, etc.;
> Heat sink assembly, thermal sensor potting, thermal conductive product potting;
> Heat conduction between the battery cell and the cold tube;
> LED and power drive potting;
| Typical Properties of TIS™ 680-12AB Series |
| Material Properties (Before Curing) |
| | TISTM680-12A | TISTM680-12B |
| Color | white | Gray |
| Viscosity @25℃ Brookfield | 3000 mPa.s | 3000 cPs |
| Shelf life @25℃ in sealed container | 6 months | 6 months |
| |
| Mixing ratio (weight ratio) | A:B =100 :100 |
| Mix color | Gray |
Operational Time
(250g @25℃) | 30 mins |
| Conditions for Complete Curing | @25℃ 24H |
| @70℃ 2H |
| @100℃ 1H |
| Material Properties(after Curing) |
| Hardness (Shore A)@25℃ | 65 |
| Density(g/cc) | 1.7 |
| Operating temperature | -40℃ ~160℃ |
| Elongation | 120% |
| Elongation | 4.50% |
| CLTE(1/℃) | 3.0x 10^(-5) |
| Fire resistance UL94 | V-0 |
| Water Absorption Rate (wt%) | < 0.1 |
| Thermal Conductivity | 1.2W/m-K |
| Thermal Impedance @1mm ( ℃- in²/W ) | 0.48 |
| Dielectric Breakdown Voltage ( V/mm) | 6000 |
| Dielectric Constant@1MHz | 4.2 |
| Volume resistivity @ 25℃( ohm-cm) | 3.0x 10^13 |
Packing details:
1KG A/B for each tank.
5KG A/B each.
10KG A/B each.
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract.
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White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component Images
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