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High Hardness Heat Sink Thermal Pad 2.0mmt For Automotive Electronics

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High Hardness Heat Sink Thermal Pad 2.0mmt For Automotive Electronics

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Brand Name : Ziitek

Model Number : TIF180-30-06UF thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

Thermal conductivity : 3.0 W/mK

keyword : Thermal Gap Pad

part number : TIF180-30-06UF

color : white

Specific gravity : 3.0 g/cc

Name : 2.0mmT Moldability for Complex Parts Heat Sink Pad For Automotive Electronics

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2.0mmT Moldability for Complex Parts Heat Sink Pad For Automotive Electronics

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

TIF100-30-06UF-Series-Datasheet-.pdf

Ziitek TIF180-30-06UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


<Good thermal conductive:3.0 W/mK
<Thickness: 2.0mmT
<Hardness:75±5 Shore 00
<Colour: White

<Naturally tacky needing no further adhesive coating
<Available in varies thicknesses
<Broad range of hardnesses available

Applications

<Automotive electronics

<Set top boxes

<Audio and video components

<IT infrastructure

<GPS navigation and other portable devices

<CD-Rom, DVD-Rom cooling

Typical Properties of TIF180-30-06UF
Product Name

TIF180-30-06UF Series
Colour
 White
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity
3.0 g/cc

Thickness
2.0mmT
Hardness
75±5 Shore 00
Dielectric constant@1MHz
5.0 MHz
Continuos Use Temp
-40 to 160℃

Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
3.0 W/mK
Volume Resistivity

2.3*1013 Ohm-cm


Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

High Hardness Heat Sink Thermal Pad 2.0mmt For Automotive Electronics



Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

High Hardness Heat Sink Thermal Pad 2.0mmt For Automotive Electronics

FAQ

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.


Product Tags:

heat sink thermal pad 2 mm

      

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